![]() New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. ![]() There has been a marked increase in university research related to solder. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. We need not look far to see solder being used to interconnect ever finer geo metries. ![]() This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. Solder is the electrical and me chanical "glue" of electronic assemblies. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
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